Name: /Tools-Info/N79e715at28 Nuvoton Smd
Brand: EstiSource
Availability: InStock

N79E715AT28 NUVOTON SMD

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N79E715AT28 NUVOTON SMD

Introduction
Material Composition
Manufacturing Process
Challenges and Limitations
Costing
Properties and Characteristics
Frequently asked questions
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N79E715AT28 – Nuvoton SMD Microcontroller

is a high-performance microcontroller developed by Nuvoton, based on the 8051 architecture and housed in a compact 28-pin SMD package. Designed for embedded control applications, this MCU features in-system programmable Flash memory, integrated analog/digital peripherals, and support for UART, SPI, and I²C communication interfaces. It is especially suitable for compact systems that require reliable performance, efficient power consumption, and versatile communication. The integration of timers, PWM, ADC, and watchdog functionality makes it ideal for automation, instrumentation, and smart appliances.

How EstiSource Helps

EstiSource simplifies the procurement of legacy and niche microcontrollers like the N79E715AT28 by leveraging a global network of authorized distributors, allocation resellers, and niche stockists. We ensure part authenticity, price competitiveness, and transparency in lead times—vital for customers managing sensitive embedded designs or legacy product lines.

Why Choose EstiSource for Sourcing N79E715AT28

EstiSource stands out by offering complete sourcing intelligence—from price benchmarking and lead time comparison to secure procurement across fragmented markets. With a focus on embedded electronics, our platform minimizes sourcing risks while accelerating go-to-market timelines for engineering and R&D teams. For critical parts like the N79E715AT28, our expertise in sourcing long-tail components ensures continuous availability and supply assurance.

1. Material Composition

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The device's core die is silicon-based, encapsulated in a plastic SMD housing that ensures durability and heat dissipation. The leadframe is typically copper alloy plated with tin for solderability. The internal bonding wires are made of gold or copper, and the IC is packaged using epoxy molding compound that ensures thermal protection and environmental resistance.

2. Manufacturing Process

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Wafer Fabrication: The semiconductor die is produced through photolithography and doping on silicon wafers using CMOS processes.
Die Bonding & Wire Bonding: The die is attached to the copper leadframe, followed by ultrasonic or thermosonic wire bonding to connect pads to external leads.
Encapsulation: The component is encapsulated with thermosetting epoxy using a transfer molding process, forming the final SMD shape.
Lead Finish: Leads are trimmed and plated with tin (Sn) to improve solderability and prevent oxidation.
Electrical Testing: Each IC undergoes rigorous functional and parametric testing for memory integrity, logic operations, and I/O interface compliance.
Laser Marking & Packaging: The device is marked with part numbers and batch codes before being sealed in anti-static reels or trays for shipment.

3. Challenges and Limitations

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Limited Processing Power

As an 8051-based MCU, it has lower performance compared to modern ARM Cortex-based designs, limiting its application in compute-intensive tasks.

Flash Memory Constraints

With relatively small Flash and RAM sizes, it is suitable for simple embedded systems but not ideal for heavy firmware applications.

Thermal Sensitivity

Despite good encapsulation, continuous high-load operation without proper heat dissipation in dense boards may affect stability.

Toolchain Dependency

Development is restricted to toolchains compatible with 8051 architecture, which may have fewer modern debugging or IDE features.

Component Availability

Like many legacy MCUs, availability may fluctuate due to limited demand or EOL risk for older families.

4. Cost Estimation & Sourcing Challenges

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Unit Pricing: ₹35–₹65 per piece depending on the supplier, package type, and MOQ. Bulk discounts apply for volumes above 500 pieces.
Prototype Costs: For sample quantities or development kits, cost can increase to ₹80–₹100 due to logistics and markup.
Sourcing Difficulty: Being a niche microcontroller, stock may be limited in general distribution channels and might require sourcing through specialized or authorized Nuvoton partners.
Lead Times: Lead times may vary between 3 to 6 weeks depending on global demand and availability in Asia-Pacific warehouses.

5. Properties and Characteristics

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Architecture

8051-compatible core, running up to 20 MHz clock frequency.

Memory

16 KB Flash memory and 256 bytes of SRAM.

Interfaces

Supports UART, SPI, I²C for peripheral and communication expansion.

Timers & ADC

3 16-bit timers, programmable watchdog timer, and 8-bit ADC.

Package

28-pin SOP or TSSOP, suitable for space-constrained PCBs.

Operating Voltage

2.4V–5.5V with wide supply tolerance for embedded applications.

ESD Protection

Integrated electrostatic discharge protection on I/O pins.

Temperature Range

-40°C to +85°C for industrial-grade use.

6. Frequently Asked Questions

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Q1: Is the N79E715AT28 suitable for automotive use?

No, this MCU is not qualified under AEC-Q100 standards and is not recommended for automotive applications without additional validation.

Q2: Can I program it using a standard 8051 programmer?

Yes, most 8051-compatible programmers can be used, especially if they support in-system programming (ISP) via UART or ICP.

Q3: What is the typical current consumption during sleep mode?

In power-down mode, the MCU typically consumes less than 10 µA, making it ideal for battery-powered designs.

Q4: What are the alternatives to this MCU?

For higher performance, consider Nuvoton’s ARM Cortex-M0+ series or Microchip’s PIC16F series for similar pin counts.

Q5: Are development boards available for this part?

Yes, Nuvoton and third-party suppliers offer demo boards and starter kits for prototyping and firmware development.

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